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  ? rgp30a thru rgp30m vishay semiconductors formerly general semiconductor document number 88704 www.vishay.com 18-nov-02 1 glass passivated junction fast switching rectifier reverse voltage 50 to 1000v forward current 3.0a maximum ratings & thermal characteristics ratings at 25c ambient temperature unless otherwise specified. rgp rgp rgp rgp rgp rgp rgp parameter symbol 30a 30b 30d 30g 30j 30k 30m unit maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current 0.375" (9.5mm) lead length at t a = 55c i f(av) 3.0 a peak forward surge current 8.3ms single half sine-wave superimposed i fsm 125 a on rated load (jedec method) maximum full load reverse current, full cycle average 0.375" (9.5mm) lead length at t a = 55c i r(av) 100 a typical thermal resistance (1) r ja 20 c/w operating junction and storage temperature range t j ,t stg ?65 to +175 c electrical characteristics ratings at 25c ambient temperature unless otherwise specified. maximum instantaneous forward voltage at 3.0a v f 1.3 v maximum dc reverse current t a = 25c 5.0 at rated dc blocking voltage t a = 125c i r 100 a maximum reverse recovery time i f = 0.5a, i r = 1.0a, i rr = 0.25a t rr 150 250 500 ns typical junction capacitance at 4.0v, 1mhz c j 60 pf notes: (1) thermal resistance from junction to ambient at 0.375? (9.5mm) lead length, p.c.b. mounted patented* do-201ad features  plastic package has underwriters laboratories flammability classification 94v-0  cavity-free glass passivated junction  capable of meeting environmental standards of mil-s-19500  high temperature metallurgically bonded construction  3.0 ampere operation at t a =55c with no thermal runaway  typical i r less < 0.2 a  fast switching for high efficiency  high temperature soldering guaranteed: 350c/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: jedec do-201ad, molded plastic over glass body terminals: plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.04 oz., 1.12 g packaging codes/options: 1/bulk - 1.5k per container, 15k per box 4/1.4k per 13" reel, 5.6k per box 23/1k per ammo. mag., 9k per box 0.210 (5.3) 0.190 (4.8) dia. 0.052 (1.32) 0.048 (1.22) dia. 1.0 (25.4) min. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) min. * glass-plastic encap- sulation technique is covered by patent no. 3,996,602, and brazed-lead assembly by patent no. 3,930,306 dimensions in inches and (millimeters)
rgp30a thru rgp30m vishay semiconductors formerly general semiconductor www.vishay.com document number 88704 2 18-nov-02 ambient temperature ( c) fig. 1 ? forward current derating curve average forward rectified current (a) fig. 3 ? typical instantaneous forward characteristics instantaneous forward voltage (v) instantaneous forward current (a) percent of rated peak reverse voltage (%) instantaneous reverse leakage current ( a) fig. 4 ? typical reverse characteristics number of cycles at 60 h z fig. 2 ? maximum non-repetitive peak forward surge current peak forward surge current (a) reverse voltage (v) junction capacitance (pf) fig. 5 ? typical junction capacitance 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1 10 t j = 25 c pulse width = 300 s 1% duty cycle 0 25 50 75 100 125 150 175 0 1.0 2.0 3.0 4.0 resistive or inductive load 0.375" (9.5mm) lead length 1 10 100 10 100 200 t j = t j max. 8.3ms single half sine-wave (jedec method) 0 20 40 60 80 100 0.01 0.1 1 10 20 10 100 1 10 100 t j = 25 c f = 1.0mh z vsig = 50mvp-p t j = 25 c t j = 75 c t j = 125 c t j = 100 c ratings and characteristic curves (t a = 25 c unless otherwise noted)


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